8L HDI 2+N+2 Mobile Main Board

Model : 2+N+2 Mobile Main Board
Layers : 8Layers
Material : TG17O FR4
Construction : 2+4+2 HDI PCB
Finished Thickness: 0.8mm
Copper Thickness O.SOZ
Color: Green/White
Surface Treatment: Immersion Gold+OSP
Mm Trace! Space: 3miI/3mil
Mm Hole: Laser Hole 0.1mm
Application : Mobile Main Board