Flexible PCB Capabilities
|
Feature
|
Capability
|
|---|
|
Overall size
|
8×12 mm to 234×490 mm |
|
Minimum trace width / spacing
|
0.08/0.08 mm (0.10/0.10 mm for 1 oz Cu) |
|
Through hole diameter
|
0.20~6.50 mm (tolerance ±0.05 mm) |
|
Minimum slot width
|
0.6 mm |
|
Minimum annular ring
|
0.1 mm |
|
Copper to hole clearance
|
0.2 mm |
|
Soldermask expansion
|
0.1 mm (each side) |
|
Minimum solder bridge
|
0.5 mm (any solder bridge narrower than this will be removed) |
|
Minimum text thickness & height
|
0.1/0.7 mm |
|
Pad To Silkscreen
|
≥0.15mm |
|
Quality control
|
Fully AOI & flying probe tested |
|
FPC Outline
|
Laser cut (tolerance ±0.1 mm; copper to edge ≥ 0.15 mm) |
Single-Sided Flex PCB
|
Layer
|
Thickness(mm)
|
Note
|
|---|
|
ENIG
|
1μ'' / 2μ" |
Nickel thickness: 80~120u" |
|
Silkscreen
|
10 μm |
White |
|
Polyimide (external)
|
12.5 μm / 25 μm |
Yellow / black (opaque) |
|
Adhesive
|
15 μm / 25 μm |
/ |
|
Copper
|
0.5 oz / 1 oz |
Electrolytic copper |
|
Polyimide (internal)
|
25 μm |
/ |
|
Stiffener
|
0.05~0.25 mm (Drawing required) |
Support Polyimide / FR4 / stainless steel / 3M tape |
|
EMI shield
|
18 μm |
single- / double-sided |
|
Total thickness
|
0.07 / 0.11 mm |
Excluding stiffener |
Double-Sided Flex PCB
|
Layer
|
Thickness(mm)
|
Note
|
|---|
|
ENIG
|
1μ'' / 2μ" |
Nickel thickness: 80~120u" |
|
Silkscreen
|
10 μm |
White |
|
Polyimide (external)
|
12.5 μm / 25 μm |
Yellow / black (opaque) |
|
Adhesive
|
15 μm / 25 μm |
/ |
|
Copper
|
0.33 oz / 0.5 oz / 1 oz |
Electrolytic copper |
|
Polyimide (internal)
|
25 μm |
/ |
|
Copper
|
0.33 oz / 0.5 oz / 1 oz |
/ |
|
Adhesive
|
15 μm |
Yellow / black (opaque) |
|
Polyimide (external)
|
12.5 μm |
/ |
|
Silkscreen
|
10 μm |
White |
|
ENIG
|
1μ'' / 2μ" |
Nickel thickness: 80~120μ" |
|
Stiffener
|
0.05~0.25 mm (Drawing required) |
Support Polyimide / FR4 / stainless steel / 3M tape |
|
EMI shield
|
18 μm |
single- / double-sided |
|
Total thickness
|
0.11 / 0.12 / 0.20 mm |
Excluding stiffener |